Printed circuit board Production and evaluation
Insulation coating hardening and drying → high temperature test chamber
interlayer joint hardening → vacuum high temperature test chamber
defoaming → 300 ℃ vacuum high temperature test chamber
thermal cycle accelerated test → cold and hot shock test chamber + conduction resistance evaluation system
temperature and humidity bias voltage accelerated test → high and low temperature damp heat test chamber, insulation resistance deterioration evaluation system
high temperature and high voltage material humidity resistance test → high and low temperature damp heat test chamber Insulation resistance deterioration evaluation system
interlayer joint hardening → vacuum high temperature test chamber
defoaming → 300 ℃ vacuum high temperature test chamber
thermal cycle accelerated test → cold and hot shock test chamber + conduction resistance evaluation system
temperature and humidity bias voltage accelerated test → high and low temperature damp heat test chamber, insulation resistance deterioration evaluation system
high temperature and high voltage material humidity resistance test → high and low temperature damp heat test chamber Insulation resistance deterioration evaluation system